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However, you may wish to see the MOS references because the Ultra-Scan is an ex-situ tool built on MOS technology.

kSA MOS Ultra/Thermal Scan

Full Sample Mapping of Curvature, Stress, Tilt, and Bow Height

The kSA MOS Ultra-Scan and Thermal-Scan systems are flexible, high-resolution scanning curvature, bow, and tilt-measurement systems. Based on proven and patented kSA MOS technology, the Ultra-Scan uses a laser array to map the two-dimensional curvature, bow, and stress of semiconductor wafers, optical mirrors, lenses – practically any polished surface.

kSA MOS Thermal-Scan adds an integrated heating chamber with process gas introduction capabilities for thermal stress analysis up to 1200 degrees C. The standard Ultra-Scan system provides a 300 mm x,y scanning range with better than 1 um scanning resolution and the Thermal-Scan can be configured for rapid heating and cooling of samples up to 200mm diameter. Optionally, larger scanning stages (larger glass panel mapping platforms) are available. Scans are fully programmable and extremely repeatable for selected area, line scan, or full area map. The system also provides quantitative film stress analysis with full area spatial map by first scanning the bare substrate and then re-scanning the sample post-process. Unmatched curvature, stress, and bow analysis capabilities are at your fingertips for obtaining large sample uniformity profiles and/or localized isolation of sub-millimeter areas of interest with very high spatial resolution.

The underlying kSA MOS technology is based on a patented approach using a single laser to generate a two dimensional laser array of spots which are reflected off the sample surface and into a high resolution CCD. Changes in the relative spot spacing’s are used to determine curvature. In this way, the system directly measures a true physical property in two dimensions that other systems – that use a point/line scan with mechanical raster technique – simply cannot capture. The ability to directly image and view the entire reflected laser array greatly simplifies use and alignment compared with position-sensitive detector techniques that use a single scanning laser.

Curved mirror scan showing polish fringes

Simultaneous detection of the array also makes the measurement inherently less sensitive to sample vibration compared with scanning-laser systems, leading to increased curvature resolution capability. And because all the laser spots move together at the same frequency, movement or tilt is not detected as a change of curvature. Through the use of sophisticated image processing and data analysis algorithms, the Ultra-Scan can easily detect micron-sized changes in spot position due to curvature changes which translates to the highest curvature/stress resolution metrology tool available.

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Product Information

Ultra-Scan Product Specifications Thermal-Scan Product Specifications Ultra-Scan Data Sheet Thermal-Scan Data Sheet

Application Notes

Patterned Silicon Wafers Curvature Repeatability Study Curvature Resolution and Sensitivity Scanning Resolution