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          MOS Ultra-Scan - Wafer Curvature and Stress Measurement

Understanding stress, strain, curvature/bow is critical for a variety of applications, including semiconductor deposition, silicon on insulator (SOI), glass, and strained silicon substrates.

Based on proven MOS technology, the fully integrated ex-situ kSA MOS Ultra-Scan maps the 2D curvature of semiconductor wafers, optical mirrors, lenses, or practically any polished surface. Typical radius-of-curvature resolution is greater than 50 kilometers on samples up to 300mm in diameter.

Please download the kSA MOS Ultra-Scan datasheet or kSA MOS Ultra-Scan specifications for more information and options.

Use your kSA MOS for a variety of tasks, including:

  • analyze stress impact of thin-film process steps
  • mapping pre-process wafer curvature to ensure flatness

The kSA MOS Ultra-Scan offers 10x higher stress resolution, lower noise, and more powerful mapping capabilities than any other system available. Our customers include industry leaders, national laboratories, and universities.

 Ultra-Scan Information

    Flyer

    Specifications

    Application Notes

    White Papers

    References

 Product Inquiry

   

Please contact us to discuss your thin-film characterization needs, including ex situ 2D stress, strain, curvature, and bow.