  Integrated Windows 2000/XP software provides analysis and display of two-dimensional film stress, stress-thickness product, wafer curvature, differential spot spacing, and strain.
Full wafer mapping, surface and polar plots of curvature, tilt, and stress.
Complete data acquisition and analysis control.
Automatic laser spot detection.
Automatic laser power control to ensure no saturation of detector as surface reflectivity changes.
Automatic laser spot centering via actuator-driven mirror control, to ensure CCD detection of array despite drift from changing curvature.
Data storage in ASCII and binary file formats facilitate alternative data analysis by user.
Transport of graphics directly to Windows clipboard or exported to Windows Metafile or Tiff format.
User-friendly standard Windows environment with extensive error checking and file handling.
High-quality 2D and 3D graphics for data display. Numerous image and graphics editing capabilities, including false coloring (using pre-loaded or user-defined color palettes), and label editing.
Direct printing of images or graphics using normal Windows printer driver settings. Cut-and-paste directly to clipboard or into other applications such as MS Word.
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